With highly integrated semiconductors such as cellular phone components, image processing technology is required for high-speed and high-precision alignment. In addition, image processing technology is used in distortion correction for high-power lens.
Measurement, defect inspection, shape and foreign substance inspection of BGA Terminal
Lead Pins Inspection
Measurement of number of lead pins and pitch, coplanarity inspection.
FAST general-purpose image processing systems and libraries have been used in detecting the extraction position when bonding the wire and the status checking after bonding.
FAST positioning systems and libraries are used in correcting the position of components after the vacuum picking with collets , and recognizing the position of the circuit board before the mounting.
FAST positioning systems have been used in finding and correcting the position of probe pins during the lighting inspection.
- Circuit Board Pattern Measurement
- Line Width Measurement
- Parts Form Measurement
- BGA Measurement
- Package Measurement
- Via (through-hole) Measurement
- Chip Form Measurement
- IC Inspection
- Package Inspection
- Mold Inspection
- Character and Seal Inspection
- BGA Inspection
- Circuit Board Inspection
- Surface Inspection
- Solder Inspection
- Engraved Mark Recognition
- 2D Bar Code Reading